It is available in different types depending on the compositions that are used, e.g. polyamide, phenoxy, aromatic polyamide. Used for shaping of DY coils, CTC wires, phonetic coils etc.
Thermal Index: 130
Chemical Basis: Polyamide
General purpose bondable enamel based on aliphatic copolyamide resins. Bonds at 140-170℃, excellent bonding strength, good humidity resistance. Resoftening at around 130-140℃.
For detailed information, please contact technical service department: Xiaobing.Yu@altana.com
Thermal Index: 130
Chemical Basis: Phenoxy Resin
General purpose bondable enamel based on phenoxy resins. Cresylic solvent system. Easy enameling, with good bonding strength. Bonds at140-170℃, resoftening temperature at around 140-150℃.
For detailed information, please contact technical service department: Xiaobing.Yu@altana.com
Thermal Index: 180
Chemical Basis: Aromatic Copolyamide
High resoftening temperature bondable enamel, mainly based on aromatic polyamide. NMP solvent system. Bonds at 180-220℃, with high bonding strength. Coils bonded can be removed from models at high temperature. Cure in the same oven with base coat.
For detailed information, please contact technical service department: Xiaobing.Yu@altana.com